- 品牌：
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- Part Status：
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- Shape：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
3,500
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
3,500
In-stock
|
提交询价 | ||
|
|
Seeed | RASPERRY PI COPP... |
1 |
5
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
2,641
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
12,616
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
5,492
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
提交询价 |
