品牌:
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  • (1)
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
图片 型号 品牌 描述 起订量 库存 操作
HSS-B20-05H CUI Devices
HEATSINK TO-220 9.8W...
5,400
RFQ
3,500
In-stock
提交询价
908-35-2-33-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN...
180
RFQ
3,500
In-stock
提交询价
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