- 品牌：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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163 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
3,672 |
3,500
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
3,500
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
3,872 |
3,500
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1,872 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,540 |
3,500
In-stock
|
提交询价 | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,500
In-stock
|
提交询价 |
