Attachment Method:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
图片 型号 品牌 描述 起订量 库存 操作
HSE-B20254-035H-02 CUI Devices
HEAT SINK, EXTRUS...
1,500
RFQ
3,500
In-stock
提交询价
HSS03-B20-P318 CUI Devices
HEAT SINK, STAMPI...
1
RFQ
2,297
In-stock
提交询价
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