- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
提交询价 | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1 |
22,235
In-stock
|
提交询价 | ||
![]() |
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,039
In-stock
|
提交询价 |