品牌:
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  • (4)
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
图片 型号 品牌 描述 起订量 库存 操作
127749 Wakefield Thermal
1.845" WIDE X 36" FLAT...
1
RFQ
3,500
In-stock
提交询价
HS05 Apex Microtechnology
HEATSINK 8P TO-3 15...
1
RFQ
3,500
In-stock
提交询价
127699 Wakefield Thermal
1.845" WIDE X 12" FLAT...
1
RFQ
46
In-stock
提交询价
127709 Wakefield Thermal
4.00" WIDE X 12" FLAT...
1
RFQ
21
In-stock
提交询价
127755 Wakefield Thermal
4.00" WIDE X 36" FLAT...
1
RFQ
29
In-stock
提交询价
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