- 品牌：
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- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 31X31X12MM... |
270 |
3,500
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1 |
1,468
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 19X19X23MM... |
1 |
31
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK BGA W/AD... |
1 |
264
In-stock
|
提交询价 |
