- 品牌：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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10 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
8,000 |
3,500
In-stock
|
提交询价 | ||
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,500
In-stock
|
提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
3,500
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,500
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000 |
3,500
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
3,500
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-220 TA... |
1 |
11,331
In-stock
|
提交询价 | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,968
In-stock
|
提交询价 | ||
|
|
Aavid | HEATSINK TO-220 W/T... |
1 |
13,320
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,588
In-stock
|
提交询价 |
