Attachment Method:
Thermal Resistance @ Forced Air Flow:
图片 型号 品牌 描述 起订量 库存 操作
HSS-B20-NP-04 CUI Devices
HEATSINK TO-220 6.5W...
6,000
RFQ
3,500
In-stock
提交询价
HSE-B20381-035H CUI Devices
HEAT SINK, EXTRUS...
1,200
RFQ
3,500
In-stock
提交询价
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