品牌:
  • (1)
  • (1)
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
图片 型号 品牌 描述 起订量 库存 操作
APR25-25-12CB/A01 CTS Corporation
HEATSINK FORGED ...
300
RFQ
3,500
In-stock
提交询价
HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 ...
1
RFQ
687
In-stock
提交询价
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