品牌:
  • (2)
  • (2)
Material:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
图片 型号 品牌 描述 起订量 库存 操作
217-36CTRE6 Wakefield Thermal
BOARD LEVEL HEAT...
3,000
RFQ
3,500
In-stock
提交询价
ATS-EXL66-300-R0 Advanced Thermal Solutions, Inc.
HEATSINK AL6063 300X...
1
RFQ
3,500
In-stock
提交询价
217-36CTE6 Wakefield Thermal
HEATSINK DPAK SM...
1
RFQ
18,763
In-stock
提交询价
ATS-EXL66-1220-R0 Advanced Thermal Solutions, Inc.
HEATSINK AL6063 1220...
1
RFQ
53
In-stock
提交询价
1 / 1 Page, 4 Records