- 品牌:
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- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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5 条记录
图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,500
In-stock
|
提交询价 | ||
![]() |
Wakefield Thermal | HEAT SINK PIN FIN... |
128 |
3,500
In-stock
|
提交询价 | ||
![]() |
Wakefield Thermal | HEAT SINK ELLIP F... |
128 |
3,500
In-stock
|
提交询价 | ||
![]() |
CTS Corporation | HEATSINK FORGED ... |
100 |
3,500
In-stock
|
提交询价 | ||
![]() |
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
3,500
In-stock
|
提交询价 |