品牌:
  • (1)
  • (2)
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
图片 型号 品牌 描述 起订量 库存 操作
903-23-1-21-2-B-0 Wakefield Thermal
HEAT SINK ELLIP F...
180
RFQ
3,500
In-stock
提交询价
HS09 Apex Microtechnology
HEATSINK TO3
1
RFQ
3,500
In-stock
提交询价
902-21-2-15-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN...
540
RFQ
3,500
In-stock
提交询价
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