品牌:
  • (1)
  • (1)
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
图片 型号 品牌 描述 起订量 库存 操作
HS03 Apex Microtechnology
HEATSINK 8P TO-3 1....
1
RFQ
3,500
In-stock
提交询价
R95-187 NTE Electronics, Inc.
HEAT SINK FOR SSR
1
RFQ
9
In-stock
提交询价
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