品牌:
  • (1)
  • (1)
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
图片 型号 品牌 描述 起订量 库存 操作
906-31-1-18-2-B-0 Wakefield Thermal
HEAT SINK ELLIP F...
180
RFQ
3,500
In-stock
提交询价
HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPI...
1
RFQ
1,745
In-stock
提交询价
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