- 品牌:
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- Part Status:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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50 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
OSEPP Electronics | RASPBERRY PI COP... |
2 |
2
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3N NANO 50.8X12.70X... |
1 |
3,500
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEATSINK FOR TO22... |
800 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3 101.6X25.4X0.21MM |
1 |
4
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3 76.2X12.07X0.21MM |
1 |
13
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
13
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3 50.8X12.07X0.21MM |
1 |
2
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3N NANO 76.2X19.1X0... |
1 |
2
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3N NANO 101.6X38.1X... |
1 |
14
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEATSINK TO-220 PW... |
5,000 |
3,500
In-stock
|
提交询价 | ||
|
Wakefield Thermal | HEATSINK |
3,000 |
3,500
In-stock
|
提交询价 | ||
|
Seeed | RASPERRY PI COPP... |
1 |
5
In-stock
|
提交询价 | ||
|
Seeed | EXTREME COOLING ... |
20 |
3,500
In-stock
|
提交询价 | ||
|
Aavid | INTEL XEON CPU CO... |
1 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | IR HEAT SPREADER... |
1 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | IR HEAT SPREADER... |
1 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | IR HEAT SPREADER... |
1 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3 76.2X25.4X0.21MM |
2 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3 101.6X38.1X0.21MM |
1 |
3,500
In-stock
|
提交询价 | ||
|
T-Global Technology | PH3N NANO 50.8X12.07X... |
1 |
3,500
In-stock
|
提交询价 |





